WSP05600 VLSI Technology I

Hiroshima University Syllabus

Japanese

Academic Year 2025Year School/Graduate School Graduate School of Advanced Science and Engineering (Master's Course) Division of Advanced Science and Engineering Quantum Matter Program

Lecture Code WSP05600 Subject Classification Specialized Education

Subject Name VLSI工学第一

Subject Name
（Katakana）ブイエルエスアイコウガクダイイチ

Subject Name in
English VLSI Technology I

Instructor WAKABAYASHI HITOSHI

Instructor
(Katakana) ワカバヤシ　ヒトシ

Campus Across Campuses (videoconferencing, etc.) Semester/Term 1st-Year, First Semester, 1Term

Days, Periods, and Classrooms (1T) Mon1-2,Thur1-2

Lesson Style Lecture Lesson Style
(More Details) Online (simultaneous interactive), Online (on-demand)

Credits 2.0 Class Hours/Week 4 Language of Instruction E : English

Course Level 6 : Graduate Advanced

Course Area（Area） 25 : Science and Technology

Course Area（Discipline） 12 : Electronics

Eligible Students

Keywords Large-scale integrated circuit (VLSI) technology, CMOS integrated circuit, scaling technology, miniaturization technology, exposure technology, film formation technology, etching technology, CMP technology, memory device technology, sensor technology, actuator technology, wiring technology, passive device technology, packaging technology, and others

Special Subject for Teacher Education 　 Special Subject 　

Class Status
within Educational
Program
(Applicable only to targeted subjects for undergraduate students)
Criterion referenced
Evaluation
(Applicable only to targeted subjects for undergraduate students)

Class Objectives
/Class Outline It is very important to understand the large-scale integrated circuit (VLSI) technology to support the modern society in the underlying. Therefore, the CMOS integrated circuit will be discussed, in particular, scaling techniques, miniaturization technology (exposure technique, film forming technique, an etching technique, ion-implantation, CMP techniques, etc.), memory device technology, sensor technology, actuator technology, interconnect technology, passive device technology, packaging technology, and others.

Class Schedule Class 1 CMOS integrated circuits and an inverter The understanding about MOSFET, CMOS, inverter etc
Class 2 Logic circuits The understanding about logic circuits
Class 3 Memory device technology (SRAM, DRAM) The understanding about memory devices such as latch circuits, SRAM, DRAM
Class 4 Memory device technology (Flash and others) Flash memory and others, such as PCM, RRAM, MRAM, STT-MRAM, FeRAM etc
Class 5 Image sensor device technology Understanding image sensor technologies
Class 6 Amplification circuit (and a differential amplifier) The understanding about amplification circuits (and a differential amplifier, etc)
Class 7 Low-power circuits The understanding about low-power consumption circuits, etc
Class 8 Overview of production technologies (wafer technology and clean technology) Overview of process technologies, especially wafer technology and clean technology
Class 9 Film deposition technology and etching technology The understanding about film deposition technology, etching technology etc
Class 10 Scaling technologies (Lithography technology) The understanding about the scaling technology and lithography technology
Class 11 Ion implantation technology Wet technology and CMP technology, and others The understanding about ion implantation technology The understanding about wet cleaning and chemical-mechanical polishing technology
Class 12 Interconnect technology, passive-device technology, and packaging technology The understanding about interconnect, passive device and assembling technologies, etc
Class 13 Layout technology, test, yield and reliability The understanding about layout technology, test yield and reliability
Class 14 Group presentations on advanced LSIs Group presentations on advanced LSIs

Text/Reference
Books,etc. Textbook(s)

/Fundamentals of Modern VLSI Devices, 2nd Edition, Yuan Taur and Tak H. Ning, Cambridge University Press
/Semiconductor Manufactureing Technology, Michael Quirk and Julian Serda, Prentice Hall
/Nanoelectronics and Information Technology, Rainer Waser, Wilery-VCH

PC or AV used in
Class,etc.

(More Details)

Learning techniques to be incorporated

Suggestions on
Preparation and
Review To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.

Requirements This course is part of the Integrated Green-niX College program (a joint program with Institute of Science Tokyo, Toyohashi University of Technology, Nagaoka University of Technology and Meiji University, based on a memorandum of understanding for credit transfer related to semiconductor talent development). Please note that you cannot register for this course unless you have completed the special audit student application procedure at your respective university beforehand.

Grading Method No Examination. However, submit the report after lectures.

Practical Experience

Summary of Practical Experience and Class Contents based on it

Message

Other

Please fill in the class improvement questionnaire which is carried out on all classes.
Instructors will reflect on your feedback and utilize the information for improving their teaching.

Academic Year	2025Year	School/Graduate School	Graduate School of Advanced Science and Engineering (Master's Course) Division of Advanced Science and Engineering Quantum Matter Program
Lecture Code	WSP05600	Subject Classification	Specialized Education
Subject Name	VLSI工学第一
Subject Name （Katakana）	ブイエルエスアイコウガクダイイチ
Subject Name in English	VLSI Technology I
Instructor	WAKABAYASHI HITOSHI
Instructor (Katakana)	ワカバヤシ　ヒトシ
Campus	Across Campuses (videoconferencing, etc.)	Semester/Term	1st-Year, First Semester, 1Term
Days, Periods, and Classrooms	(1T) Mon1-2,Thur1-2
Lesson Style	Lecture	Lesson Style (More Details)	Online (simultaneous interactive), Online (on-demand)

Credits	2.0	Class Hours/Week	4	Language of Instruction	E : English
Course Level	6 : Graduate Advanced
Course Area（Area）	25 : Science and Technology
Course Area（Discipline）	12 : Electronics
Eligible Students
Keywords	Large-scale integrated circuit (VLSI) technology, CMOS integrated circuit, scaling technology, miniaturization technology, exposure technology, film formation technology, etching technology, CMP technology, memory device technology, sensor technology, actuator technology, wiring technology, passive device technology, packaging technology, and others
Special Subject for Teacher Education		Special Subject
Class Status within Educational Program (Applicable only to targeted subjects for undergraduate students)
Criterion referenced Evaluation (Applicable only to targeted subjects for undergraduate students)
Class Objectives /Class Outline	It is very important to understand the large-scale integrated circuit (VLSI) technology to support the modern society in the underlying. Therefore, the CMOS integrated circuit will be discussed, in particular, scaling techniques, miniaturization technology (exposure technique, film forming technique, an etching technique, ion-implantation, CMP techniques, etc.), memory device technology, sensor technology, actuator technology, interconnect technology, passive device technology, packaging technology, and others.
Class Schedule	Class 1 CMOS integrated circuits and an inverter The understanding about MOSFET, CMOS, inverter etc Class 2 Logic circuits The understanding about logic circuits Class 3 Memory device technology (SRAM, DRAM) The understanding about memory devices such as latch circuits, SRAM, DRAM Class 4 Memory device technology (Flash and others) Flash memory and others, such as PCM, RRAM, MRAM, STT-MRAM, FeRAM etc Class 5 Image sensor device technology Understanding image sensor technologies Class 6 Amplification circuit (and a differential amplifier) The understanding about amplification circuits (and a differential amplifier, etc) Class 7 Low-power circuits The understanding about low-power consumption circuits, etc Class 8 Overview of production technologies (wafer technology and clean technology) Overview of process technologies, especially wafer technology and clean technology Class 9 Film deposition technology and etching technology The understanding about film deposition technology, etching technology etc Class 10 Scaling technologies (Lithography technology) The understanding about the scaling technology and lithography technology Class 11 Ion implantation technology Wet technology and CMP technology, and others The understanding about ion implantation technology The understanding about wet cleaning and chemical-mechanical polishing technology Class 12 Interconnect technology, passive-device technology, and packaging technology The understanding about interconnect, passive device and assembling technologies, etc Class 13 Layout technology, test, yield and reliability The understanding about layout technology, test yield and reliability Class 14 Group presentations on advanced LSIs Group presentations on advanced LSIs
Text/Reference Books,etc.	Textbook(s) /Fundamentals of Modern VLSI Devices, 2nd Edition, Yuan Taur and Tak H. Ning, Cambridge University Press /Semiconductor Manufactureing Technology, Michael Quirk and Julian Serda, Prentice Hall /Nanoelectronics and Information Technology, Rainer Waser, Wilery-VCH
PC or AV used in Class,etc.
(More Details)
Learning techniques to be incorporated
Suggestions on Preparation and Review	To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class. They should do so by referring to textbooks and other course material.
Requirements	This course is part of the Integrated Green-niX College program (a joint program with Institute of Science Tokyo, Toyohashi University of Technology, Nagaoka University of Technology and Meiji University, based on a memorandum of understanding for credit transfer related to semiconductor talent development). Please note that you cannot register for this course unless you have completed the special audit student application procedure at your respective university beforehand.
Grading Method	No Examination. However, submit the report after lectures.
Practical Experience
Summary of Practical Experience and Class Contents based on it
Message
Other
Please fill in the class improvement questionnaire which is carried out on all classes. Instructors will reflect on your feedback and utilize the information for improving their teaching.

Back to syllabus main page