| Academic Year |
2024Year |
School/Graduate School |
Graduate School of Advanced Science and Engineering (Master's Course) Division of Advanced Science and Engineering Quantum Matter Program |
| Lecture Code |
WSP03100 |
Subject Classification |
Specialized Education |
| Subject Name |
LSI集積化工学 |
Subject Name
（Katakana） |
エルエスアイシュウセキカコウガク |
Subject Name in
English |
LSI Devices and Process Engineering |
| Instructor |
KUROKI SHIN-ICHIRO,TERAMOTO AKINOBU,UCHIDA KATSUNORI |
Instructor
(Katakana) |
クロキ シンイチロウ,テラモト アキノブ,ウチダ カツノリ |
| Campus |
Higashi-Hiroshima |
Semester/Term |
1st-Year, First Semester, 1Term |
| Days, Periods, and Classrooms |
(1T) Thur1-4：AdSM 401N |
| Lesson Style |
Lecture |
Lesson Style
(More Details) |
|
| Lecture and Training of Layout Design |
| Credits |
2.0 |
Class Hours/Week |
|
Language of Instruction |
B
:
Japanese／English |
| Course Level |
6
:
Graduate Advanced
|
| Course Area（Area） |
25
:
Science and Technology |
| Course Area（Discipline） |
12
:
Electronics |
| Eligible Students |
Student in the master course |
| Keywords |
Process, LSI, MOS devices |
| Special Subject for Teacher Education |
|
Special Subject |
|
Class Status
within Educational
Program
(Applicable only to targeted subjects for undergraduate students) | |
|---|
Criterion referenced
Evaluation
(Applicable only to targeted subjects for undergraduate students) | |
|---|
Class Objectives
/Class Outline |
Understanding of physical and chemical principles of LSI fabrication processes such as oxidation, diffusion, thin-film deposition, lithography, etching, vacuum processes and so on. Next, state-of -the-art technologies for current MOS devices are learned. In the latter part the training of design of SRAM is carried out and deeply understand the technologies and theories. |
| Class Schedule |
Lesson1 Review of LSI Fabrication Process and Exercise for MOSFETs
Lesson2 Miniaturization and Integration Technology of MOS Devices
Lesson3 Si Oxide (method, mechanism for Si oxidation)
Lesson4 Thin Film Formation (Si dioxide, nitride, metal, silicide)
Lesson5 Impurity Doping and Ion Implantation
Lesson6 Lithography (optical and electron beam) , Cleaning
Lesson7 Etching (Wet-chemical, plasma), CMP and Damacene Process
Lesson8 Structure of MOS Deices and Its Fabrication Process (part I)
Lesson9 Structure of MOS Deices and Its Fabrication Process (part II)
Lesson10 Basic Layout of SRAM Cell and Fabrication Process (part I)
Lesson11 Basic Layout of SRAM Cell and Fabrication Process (part I)
Lesson12 Technology for High-Density SRAM Cell
Lesson13 Introduction of DRAM Operation
Lesson14 Integrated Circuits and their Reliability
Lesson15 Future Prospect of Si Integration Technology
Quiz in the class, submission of reports. |
Text/Reference
Books,etc. |
Handouts are distributed, reference books are introduced in the class. |
PC or AV used in
Class,etc. |
|
| (More Details) |
Projector main, vido clips. |
| Learning techniques to be incorporated |
|
Suggestions on
Preparation and
Review |
Review for each class. |
| Requirements |
|
| Grading Method |
Report (~60%), quiz (~40%) |
| Practical Experience |
|
| Summary of Practical Experience and Class Contents based on it |
|
| Message |
|
| Other |
|
Please fill in the class improvement questionnaire which is carried out on all classes.
Instructors will reflect on your feedback and utilize the information for improving their teaching. |